Ka Shui Group was Invited to Attend Lenovo Tech World’25 Hong Kong
ARTICLE OF 2025-03-07
Lenovo Tech World’25 Hong Kong was held in Hong Kong on 5th March 2025. Ka Shui International Holdings Limited (Stock Code: 822) (“Ka Shui”) was invited by Lenovo Group to attend the Artificial Intelligence (“AI”) Forum of the above event. This event gathered global tech giants, innovation pioneers, and technical experts to jointly explore cutting-edge technological trends, in particular innovative applications and development in AI.
Ka Shui has achieved remarkable results in integrating the R&D of modified lightweight materials with AI technology. Recently, its self-developed high-fluidity rare earth magnesium alloy material, leveraging its superior fluidity and ultra-thin wall thickness features, the material has been successfully used in Lenovo’s first commercial AI PC in the world — the ThinkPad X1 Carbon Aura AI laptop, assisting AI terminals in achieving lightweight and high-performance.
Furthermore, Ka Shui’s launch of next-generation high-thermal-conductivity magnesium alloy, with a thermal conductivity of 130–150 W/(m·K), is expected to further improve the heat dissipation capabilities of AI devices, facilitating more stable operational performance.
In future, Ka Shui will collaborate with more top-notch global AI technology enterprises to explore the applications of advanced magnesium alloy modified materials in AI products, propelling the industry toward an intelligent new era.
Ka Shui has achieved remarkable results in integrating the R&D of modified lightweight materials with AI technology. Recently, its self-developed high-fluidity rare earth magnesium alloy material, leveraging its superior fluidity and ultra-thin wall thickness features, the material has been successfully used in Lenovo’s first commercial AI PC in the world — the ThinkPad X1 Carbon Aura AI laptop, assisting AI terminals in achieving lightweight and high-performance.
Furthermore, Ka Shui’s launch of next-generation high-thermal-conductivity magnesium alloy, with a thermal conductivity of 130–150 W/(m·K), is expected to further improve the heat dissipation capabilities of AI devices, facilitating more stable operational performance.
In future, Ka Shui will collaborate with more top-notch global AI technology enterprises to explore the applications of advanced magnesium alloy modified materials in AI products, propelling the industry toward an intelligent new era.
