Recently, the 2025 LCFC Supplier Conference, themed “AI Leading the Way, Creating the Future Together,” successfully concluded in Hefei, gathering over 500 global industry partners to explore new paths for industrial transformation under the wave of artificial intelligence. At the event, Ka Shui International Holdings Limited (Stock Code: 00822.HK) (“Ka Shui Group”) won the “Technology Innovation Award” for its breakthrough advancements in magnesium alloy, aluminum alloy new materials, and eco-friendly surface treatment technologies. These innovations provide core solutions to the heat dissipation challenges and lightweight requirements faced by the AI PC industry, earning high recognition from LCFC and industry peers.


Ka Shui Group has long been focusing on high thermal conductivity and lightweight materials. The award-winning technologies directly address the performance challenges of AI PCs. As AI chips continue to deliver higher computing power, heat dissipation efficiency and portability have become critical bottlenecks on user experience. Traditional PC materials struggle to balance high thermal conductivity with lightweight design. Ka Shui Group’s independently developed magnesium and aluminum alloy materials, enhanced through modification and precision forming processes, successfully achieved high strength, high thermal conductivity and lightweight performance, marking three major breakthroughs. For example, its ultra-thin magnesium alloy product is just 0.45 mm thick, when applied to a 14-inch AI PC chassis, weighs just 52 grams representing over 30% lighter than traditional materials which perfectly meets the sub 1 kg portability standard for AI PCs. The new die-cast aluminum alloy materials feature excellent thermal conductivity, rapidly transfer the heat generated by chips. Combined with anodizing technology, they improve heat dissipation efficiency while delivering superior corrosion resistance and eco-friendly surface treatment that surpasses conventional processes in both efficiency and appearance.


As a global leader in PC manufacturing, LCFC highlighted “heat dissipation and lightweight materials” as core innovation directions for AI PCs during its Technology Innovation Forum. Leveraging its one-stop services capabilities ranging from material R&D and mold design to precision manufacturing. Ka Shui Group has established deep collaboration with LCFC in AI PC structural components. Its new material solutions have already improved the heat dissipation efficiency of terminal products by over 10% and reduced the weight of individual products by 30%, delivering smooth users experience even under heavy workloads. Ka Shui Group operates production bases in Huizhou, Shenzhen, Wuhu, Suzhou, Yulin, and Mexico and holds more than 120 domestic and international patents. Its central laboratory is the first third party testing institution in the industry certified by CNAS. This robust technical foundation provides strong support for product innovation.


This award not only recognizes the collaboration between Ka Shui Group and LCFC but also affirms the industry’s appreciation for the value of lightweight material innovation. Looking ahead, Ka Shui Group will continue to focus on material needs in AI PCs, AI cooling systems, and new energy sectors, deepening R&D investment in semi-solid forming and eco-friendly surface treatment technologies. The Group is also dedicated to drive breakthroughs in magnesium and aluminum alloy applications across more AI terminal scenarios, working hand-in-hand with partners across the industry to build an innovation ecosystem for the AI era and accelerate the upgrade of AI technology products through technology innovation.