Celebrating its 50th anniversary, Inventec Co., Ltd. (“Inventec”) reaches a significant milestone in 2025. As a leading global electronic product manufacturing and design company, Inventec specializes in the assembly and production of personal computers. With evolving market demand and technological advancement, the company has gradually expanded its business scope to include servers, networking devices, consumer electronics, IoT devices and etc. In recent years, Inventec has been devoted to promoting the development and application of artificial intelligence (“AI”) technology, such as smart healthcare, smart manufacturing, robotics, autonomous driving system, and E-Cockpit system. As a long-term partner of Inventec, Ka Shui International Holdings Limited (Stock Code: 822) (“Ka Shui”), fully supports the development of Inventec in AI. We hope that our high-thermal-conductivity magnesium alloy can meet the heat dissipation requirement of various AI products. 


In terms of computer casings, Ka Shui has had in-depth collaboration with Inventec in both structural design and materials research over the past 15 years. The ever- increasing product demands from our clients has driven us to continuouly improving our technology. Leveraging our recent breakthroughs in magnesium alloy modification— high-thermal-conductivity magnesium alloy, we look forward to assisting our clients in advancing their AI products initiatives.

 
Introduction to High-Thermal-Conductivity Magnesium Alloy
In 2021, Ka Shui launched its self-developed first-generation high-thermal-conductivity magnesium alloy, HTCM-1, with a thermal conductivity of 100-120 W/（m.K）, which was twice that of the standard magnesium alloy AZ91D. This alloy significantly enhances the heat dissipation performance of smart electronic devices. In 2023, HTCM-1 had been successfully applied to internal components of tablet computers from globally renowned brands. Recently, Ka Shui introduced the upgraded high-thermal-conductivity magnesium alloy, HTCM-3, with a thermal conductivity of 130-150 W/(m·K), which is expected to further improve the heat dissipation capabilities of AI devices.
Photos: Reported by Taiwan Economic Daily on June 4, 2024
https://money.udn.com/money/story/5612/8008889